Amid the rapid development of cutting-edge technologies like 5G and AI, the demand for IoT connectivity is experiencing explosive growth. According to IoT Analytics, the number of global IoT connections is expected to surpass 27 billion by 2025. As the core components of IoT terminals, the performance of IoT chips is crucial, influencing both the intelligence of terminal devices and the pace of industry upgrades.

This week at MWC 2025 in Barcelona, over 2,700 exhibitors from 205 countries and regions gathered to explore frontier topics such as AI-communication integration and IoT innovation?. XINYI Information Technology, also known as XINYISEMI, a leading Chinese enterprise in cellular IoT chips, made a remarkable debut that captured global attention?.

At the exhibition, XINYISEMI showcased its range of ?mid-to-low-speed IoT communication chips? and partner module products integrated with these chips. The spotlight was on the market-favored ?NB-IoT SoC XY1200 series? and ?Cat.1 bis SoC XY4100LC/XY4100LD?, alongside the debut of upcoming ?IoT NTN and GNSS solutions.??

Sole Chinese Company Selected at ISSCC 2025, Showcasing Pioneering Innovation

Ahead of MWC Barcelona, XINYISEMI distinguished itself as the ?only mainland Chinese company? invited to present industrial research papers at the prestigious ?International Solid-State Circuits Conference (ISSCC 2025), often dubbed the “Olympics of Chip Design.”Their pioneering work on the ?XY4100LD product placed them alongside global semiconductor giants like Samsung and Intel, highlighting China's growing strength in chip design innovation.

The XY4100LD chip solution, leveraging a cost-effective QFN package for LTE Cat.1bis, offers distinct advantages over the industry’s conventional BGA packaging . This product excels in circuit technology innovation, performance, chip size control, etc, establishing its strong competitive edge.

Dr. Jianhong Xiao, founder and CEO of XINYISEMI, attributed their breakthrough in QFN packaging to their chip design team's targeted solutions that overcome technical hurdles, including RF performance, electrostatic discharge resistance, and PCB layout challenges. This achievement is a testament to the company’s commitment to "technology as king and innovation as the foundation," driving the continuous development of more competitive products.

The XY4100LC, already in mass production, shares many features with the XY4100LD, including high integration, ultra-low power consumption, and cost-effectiveness. Featuring a domestic RISC-V processor with built-in 16KB instruction cache and data cache, it offers a fully open processor core and independent memory space. With a wide range of peripheral interfaces, the product is well-suited for IoT applications in sectors like smart payments, the sharing economy, and location tracking.

From domestic to Global Markets: Empowering Worldwide Digital Transformation?

Leveraging its strong innovation and R&D capabilities, XINYISEMI has emerged as a rising force in the ?LTE Cat.1 bis sector? while reinforcing its leadership in ?NB-IoT? through unparalleled technical expertise and market influence. Collaborating closely with major module manufacturers such as China Mobile IoT, Quectel, Meige, and SimCom, the company has achieved a milestone with its high-integration 5G NB-IoT narrowband IoT chips, reaching a cumulative shipment of 150 million units. These chips are widely applied in scenarios like smart metering, smart firefighting, and smart transportation.

At the MWC event, XINYISEMI’s solutions, in partnership with key players, became a highlight of the exhibition, attracting considerable interest from international clients. Capitalizing on its domestic market success, XINYISEMI has keenly recognized the burgeoning demand for IoT products in international markets.

Reports indicate that the Spanish Transportation Authority plans to replace traditional vehicle triangle warning signs with more use-friendly and recognizable alert lights starting in 2024. This shift is expected to create demand for ?20 million units locally, with similar trends anticipated across Europe?. In the near future, IoT modules developed by leading global module manufacturers based on XINYISEMI's NB-IoT platforms, like XY1100 and XY1200S, are set to be widely deployed in warning lights, significantly enhancing road safety and reducing accidents.

The XY1200S, XINYISEMI’s flagship NB-IoT SoC product, exemplifies cutting-edge technology with its ultra-fast wake-up features, ideal for devices like warning lights that require prolonged standby times. This single chip addresses both communication and main control needs for terminal products, integrating functions such as PA, filters, switches, and low-power MCU. Additionally, XY1200S supports various communication protocols and offers extensive peripheral interfaces to facilitate user development.

Notably, XINYISEMI is actively developing 5G NTN satellite communication chips and GNSS navigation chips compatible with NB-IoT standards, aiming to integrate different communication formats into a single chip to meet the pressing needs of overseas customers. Dr. Jianhong Xiao emphasized the company's ?internationalization strategy?, stating,"As an international enterprise, XINYISEMI has been laying the foundation for its international market presence, and its innovative products will soon be available worldwide."

AI-driven Products: Harnessing 5G+AI for New Opportunities?

XINYISEMI is steadfast in its ambition to lead the industry in 5G IoT smart terminal SoCs. Since its inception, the company has delivered its self-developed chips to over 200 IoT customers, with its products and services reaching across Asia, Europe, and the Americas. Beyond its mass-produced low to medium-speed NB-IoT and Cat.1 product lines, XINYISEMI is gearing up to introduce its competitive 5G RedCap/eRedCap chips.

The fusion of 5G and AI is unlocking transformative opportunities for industrial evolution, a central theme at this year's MWC. Dr. Jianhong Xiao, expressing excitement at the exhibition, highlighted that the maturation and rapid commercial deployment of 5G technology, when combined with AI, will propel the intelligent upgrade of cellular networks and enable the monetization of network experiences. The synergy of 5G+AI is expected to spawn a variety of new industries and business models, such as edge computing, further promoting the innovation and application of 5G and AI technologies.

In anticipation of this trend, XINYISEMI has already integrated edge AI capabilities into its existing products to enhance client services?. Looking ahead, the company plans to deepen AI integration across its product portfolio, leveraging technological breakthroughs to propel the development of IoT industry?.